Siemens and ASE Collaborate to Develop 3Dblox-based Workflow for VIPack™ Advanced Packaging Platform

Siemens and ASE develop 3Dblox-based workflow for VIPack™ advanced packaging

Siemens Digital Industries Software and ASE Group (Advanced Semiconductor Engineering) are partnering to bring 3Dblox-based workflows to ASE’s VIPack™ advanced packaging platform.

This collaboration leverages Siemens’ Innovator3D IC™ (3Dblox-certified) to enable open, interoperable design and verification for advanced packaging.

Key innovations and supported technologies

• 3Dblox & Innovator3D IC: native read/write of 3Dblox format for open interoperability across EDA tools.
• VIPack™ platform: six core packaging pillars enabling vertical integration and high-density heterogeneous integration.
• Validated workflows: fan-out on substrate chip-on-package (FOCoS), FOCoS-Bridge, and TSV-based 2.5D/3D IC technologies.
• Advanced processes: RDL, embedded integration, chiplet-based designs, and STCO-driven hierarchical device planning.

Benefits include faster design assembly exploration, flexible EDA tool choices, and accelerated time-to-market for multi-chip packages and heterogeneous integration projects.

Siemens and ASE aim to simplify design flows, improve cross-tool interoperability, and support customers tackling complex packaging challenges.

Call to action: Contact your Siemens or ASE representative or visit their official websites to explore 3Dblox-enabled VIPack workflows, request demos, and accelerate your advanced packaging initiatives.