Siemens Tessent IJTAG Pro Accelerates 3D IC Testing with High-Bandwidth IJTAG

Siemens Digital Industries Software launches Tessent IJTAG Pro, transforming IEEE1687-based IJTAG I/O from serial to parallel.

This high-bandwidth IJTAG leverages the Tessent SSN wide-bus architecture to speed up test vector transfer and cut ATE costs.

Key benefits

• Reduced test time via parallel IJTAG and SSN integration.
• Supports 2.5D and 3D IC architectures, including chiplets.
• Optimized for BIST and mixed-signal IP testing to improve throughput.
• Custom hardware read/write access and high data flow for scalable testing.

Why it matters for AI and semiconductor teams

As transistor density and multi-die designs grow, test vector counts and ATE costs surge. Tessent IJTAG Pro helps AI chip designers and test engineers shorten test cycles and maintain competitive edge.

Early adopters report much faster vector transfer and reduced test application time. Combine with Tessent AnalogTest for expanded analog and bandwidth testing capabilities.

Learn more about Tessent IJTAG Pro

Keywords: Tessent IJTAG Pro, IJTAG, IEEE1687, SSN, Tessent, 3D IC, chiplet, BIST, ATE cost, semiconductor test.

Call to action: Evaluate Tessent IJTAG Pro to accelerate your complex IC testing and reduce costs today.