Mc68EO30RP40B PLC Module: 2026 Technical Guide – Specs, Integration & ROI Analysis

Mc68EO30RP40B PLC Module: 2026 Technical Guide – Specs, Integration & ROI Analysis

Pre-shipment Inspection Record: This document details the visual and technical inspection of the Mc68EO30RP40B PLC Module: 2026 Technical Guide – Specs, Integration & ROI Analysis. All product photos and testing videos below are original materials captured first-hand by the Koeed technical team in our warehouse prior to dispatch.

The item filed as Mc68EO30RP40B is a loose pin-grid electronic component. The first two photographs show its edge and underside; they do not show a readable top marking. Although the article title calls it a PLC module, these photographs do not document a complete PLC assembly.

Identification and delivery details

The source gives Japan as the manufacturing country and an upload date of 8 July, with record creation on 9 July 2025. No country marking is visible in the reviewed views. The recorded weight is zero, which provides no usable shipment mass.

Photograph 1 shows projecting pins beneath a thin black package. Photograph 2 shows rows of pins around a green central underside area. Fingers obscure part of the package in both views, so these images cannot establish a complete pin count or the condition of every pin.

The catalogue contains MC68EC030RP40B microprocessor entries, whose spelling differs from the source's Mc68EO30RP40B. Without the top marking, this review cannot establish that they identify the same part. Condition, supply quantity, warranty and functional results are not stated clearly in the source.

Photographed markings and delivery record
Item Evidence
Source identifier Mc68EO30RP40B
Photographed form Loose pin-grid electronic component
Country in source Japan; not confirmed by these views
Source dates Upload 8 July; record created 9 July 2025
Recorded weight 0; no usable mass information
Unconfirmed Exact model, brand, condition, quantity, performance and warranty

Swipe or scroll horizontally to read the full table.

Photographs 1 and 2 were reviewed. Three other photographs and the recorded MOV clip are preserved; the other photographs were not visually reviewed. All six unique source files were fully downloaded and byte/SHA checked.

Matching this part

Request a clear top photograph showing the entire model, manufacturer and revision markings. Resolve the EO30 versus EC030 spelling before choosing a catalogue item or a replacement.

Compare the host board's documented package and pin assignment with the identified device. Ask the supplier to report the offered unit's condition and test scope; the underside photographs do not prove processor operation.

Photos and recorded media

Reviewed photograph 1: side view of a black package held between fingers, with projecting pins visible below.
Reviewed photograph 1: side view of a black package held between fingers, with projecting pins visible below.
Reviewed photograph 2: pin-grid underside surrounding a green central area; fingers obscure part of the package.
Reviewed photograph 2: pin-grid underside surrounding a green central area; fingers obscure part of the package.
Source-record photograph 3 filed under Mc68EO30RP40B.
Source-record photograph 3 filed under Mc68EO30RP40B.
Source-record photograph 4 filed under Mc68EO30RP40B.
Source-record photograph 4 filed under Mc68EO30RP40B.
Source-record photograph 5 filed under Mc68EO30RP40B.
Source-record photograph 5 filed under Mc68EO30RP40B.

Recorded inspection clip. The clip is retained as delivery evidence; no performance measurement is inferred from it.

See the separate MC68060RC50 delivery record for another legacy component. These identifiers do not establish interchangeability. Send Koeed the full top marking to resolve the source spelling.

Request this part

Provide a readable full model marking, host board identifier and required quantity. Confirm the supplied suffix, package condition and test evidence before ordering.

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Send us the part number or article link — we will confirm price, availability and lead time.

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