Siemens and ASE Collaborate to Develop 3Dblox-based Workflow for VIPack™ Advanced Packaging Platform
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Siemens and ASE Collaborate to Develop 3Dblox-based Workflow for VIPack™ Advanced Packaging Platform
Siemens Digital Industries Software and ASE Group (Advanced Semiconductor Engineering) are partnering to bring 3Dblox-based workflows to ASE’s VIPack™ advanced packaging platform.
Detail
This collaboration leverages Siemens’ Innovator3D IC™ (3Dblox-certified) to enable open, interoperable design and verification for advanced packaging.
: six core packaging pillars enabling vertical integration and high-density heterogeneous integration.
: fan-out on substrate chip-on-package (FOCoS), FOCoS-Bridge, and TSV-based 2.5D/3D IC technologies.
: RDL, embedded integration, chiplet-based designs, and STCO-driven hierarchical device planning.
Benefits include faster design assembly exploration, flexible EDA tool choices, and accelerated time-to-market for multi-chip packages and heterogeneous integration projects.
Siemens and ASE aim to simplify design flows, improve cross-tool interoperability, and support customers tackling complex packaging challenges.
Contact your Siemens or ASE representative or visit their official websites to explore 3Dblox-enabled VIPack workflows, request demos, and accelerate your advanced packaging initiatives.
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